Axera Semiconductor Co., Ltd. is a Chinese fabless semiconductor designer specializing in AI inference system-on-chips (SoCs) for edge computing, on-device intelligence and smart vehicle applications. Founded in 2019, the company has quickly emerged as a leading global provider of mid-to-high-end visual edge AI inference chips, particularly for cameras, industrial devices and automotive platforms.
Axera is launching its Initial Public Offering (IPO) on the Hong Kong Stock Exchange (Main Board) to raise about HK$2.96 billion (≈ $379 million) by offering approximately 104.9 million H-shares at HK$28.20 per share. The public offering period runs from 30 January to 5 February 2026, with listing & trade commencement expected on 10 February 2026.
The IPO is supported by heavyweight investors including Tencent and Qiming Venture Partners, with cornerstone participation by WILL Semiconductor (OmniVision unit) and JSC International Investment Fund SPC.
IPO DETAILED INFORMATION
Issue Details
| Parameter | Details |
| IPO Type | Global Offering – Main Board (Hong Kong) |
| Exchange | Hong Kong Stock Exchange (HKEX) |
| IPO Open Date | 30 January 2026 |
| IPO Close Date | 5 February 2026 |
| Price Per Share | HK$28.20 |
| Currency | Hong Kong Dollars |
| Total Shares Offered | ~104,915,200 H-shares |
| Issue Size | ~HK$2.96 billion (~$379.2 million) |
| Lot Size (Hong Kong) | 100 shares per lot |
| Min Investment | ~HK$2,820 (100 shares) |
| Over-allotment Option | ~15% (up to ~15.7 million shares) |
| Listing Date (Expected) | 10 February 2026 |
| Sponsors / Joint Sponsors | CICC, Guotai Junan Intl, CCB Intl (Asia) |
Issue Break-up (approximate based on filings)
| Tranche | Allocation |
| Hong Kong Public Offering | ~10% (~10.5 million shares) |
| International Placing | ~90% (~94.4 million shares) |
| Total | 100% (~104.9 million shares) |
| Includes potential overallotment shares if exercised. |
Selling Shareholders (OFS)
NO Promoter OFS (Offer for Sale) — this IPO is a primary issuance of new shares to raise capital for corporate growth and strategic R&D; existing investors are not exiting.
Objects of the Issue (Fund Utilization)
Proceeds from the IPO are planned to be used for:
- Upgrading the technology platform — invest in next-gen AI chip R&D.
- Developing new AI inference products — expanding product portfolio.
- Sales expansion — global market penetration and customer support.
- Equity investments or acquisitions — strategic deals to enhance competitiveness.
- Working capital & general corporate purposes — operational flexibility and scaling efforts.
Fund usage focuses on broadening tech leadership and accelerating commercialization.
Lead Managers & Sponsors
- Joint Sponsors:
• China International Capital Corporation (CICC)
• Guotai Junan International
• CCB International (Asia)
These firms underwrite and manage the offering on HKEX.
Promoters & Management
Axera Semiconductor was founded in May 2019, with headquarters and R&D operations in China. Its leadership includes founders and executives with deep experience in semiconductor design and AI computing architectures, propelling rapid product development and market growth.
Key investors backing the company before IPO include:
- Tencent Investment
- Qiming Venture Partners
- Other venture capital / strategic technology funds
Prominent backers signal strong confidence in long-term AI chip prospects.
Company Details
Business Focus:
Axera specializes in designing AI inference system-on-chips (SoCs) that enable on-device AI computing, reducing reliance on cloud servers. Its products serve:
- Visual perception & edge computing (e.g., AI cameras)
- Smart vehicles & driver assistance systems
- Industrial IoT and automation devices
- Consumer electronic and robotics platforms
Axera’s proprietary technologies include the AXProton AI-ISP (AI image signal processor) and Axera Neutron mixed-precision NPU (neural processing unit), which together form a scalable platform for AI application across diverse hardware.
Global Position:
According to filings, Axera was the largest mid-to-high-end visual on-device AI inference chip supplier globally by shipment volume in 2024, a strong endorsement of its technology and execution at a young industry age.
Financial Snapshot (2022 – 2025 periods)
| Period | Revenue (RMB) | Net Profit / Loss (RMB) | Growth Notes |
| 2022 | ~50.2 M | — loss | Early commercial phase |
| 2023 | ~2,301 M | — loss | Scale chip output |
| 2024 | ~4,729 M | — loss | Growing shipments |
| 9M 2025 | ~2,690 M | ~-855.7 M loss | Revenue +5.8% YoY but widening net loss |
Company Strengths
- Global leadership in edge AI inference chips — largest mid-to-high-end supplier by shipments.
- Strong investor backing — Tencent, Qiming VP validate growth prospects.
- Proprietary technology platforms (AI-ISP, NPU) powering diverse AI applications.
- Positioned for fast-growing markets — smart vehicles, IoT, robotics, smart cameras.
- Cornerstone investor participation — early commitment may support listing stability.
Key Risks & Challenges
- Continuous net losses — heavy R&D and marketing expenses create sustained loss profiles.
- Capital-intensive semiconductor industry — high barriers to profitable scaling.
- Global competition — rivalry from entrenched AI and semiconductor giants worldwide.
- Market sentiment volatility — tech IPOs can fluctuate rapidly post-listing.
- Execution risk — delivering on product roadmaps and automotive/edge adoption is complex.
Disclaimer
This document is for informational and educational purposes only and does not constitute investment advice or a recommendation. Investors should read the official prospectus and consult certified financial advisors before investing. Past performance is not indicative of future results.
Source: Prospectus
